News/2023-06-25 の履歴(No.1)

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  • 1 (2023-06-27 (火) 11:19:41)
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Transducers 2023で論文発表。
Papers are presented at Transducers 2023.
2023-06-25~29†

1. Ryugo Shimamura, Shun Yasunaga, Kei Misumi, Anne-Claire Eiler, Akio Higo, Gilgueng Hwang, Ayako Mizushima, Dongchen Zhu, Kikuo Komori, Yasuyuki Sakai, Hiroshi Toshiyoshi, Agnès Tixier-Mita, and Yoshio Mita, "A BIMODAL "SENSOR CHIPLET" PLATFORM APPLIED FOR ALBUMIN AND PH MULTI-CHEMICAL SENSING," in Proc. 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2023), June 25-29, 2023, Kyoto International Conference Center, Kyoto, Japan, pp. XXX-XXX. (accepted, late news poster 2023-03-23)
2. Yuto Akai, Hiroaki Honma, and Hiroshi Toshiyoshi, "FREQUENCY TRACKING OF VIBRATIONAL ENERGY HARVESTER USING PHASE-LOCKED LOOP (PLL)," in Proc. 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2023), June 25-29, 2023, Kyoto International Conference Center, Kyoto, Japan, pp. XXX-XXX. (accepted, oral, 2023-02-24)
3. Hiroaki Honma, Yukiya Tohyama, and Hiroshi Toshiyoshi, "A MEMS VIBRATIONAL ENERGY HARVESTER CAPABLE OF RESTLESS CHARGING CAPACITOR FROM RANDOM VIBRATIONS," in Proc. 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2023), June 25-29, 2023, Kyoto International Conference Center, Kyoto, Japan, pp. XXX-XXX. (accepted, poster, 2023-02-24)
4. Riku Ito, Ten Sekiguchi,Vivek Menon, Ryo Ichige, Yuya Tanaka, Hiroshi Toshiyoshi, and Takaaki Suzuki,"NEAR-ZERO POISSON'S RATIO AND LARGE-AREA METAMATERIAL MADE OF UV-PDMS USING 3D BACKSIDE EXPOSURE," in Proc. 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers 2023), June 25-29, 2023, Kyoto International Conference Center, Kyoto, Japan, pp. XXX-XXX. (accepted, poster, 2023-02-24)
5. Sara GUERREIRO, Markus BAINSCHAB, Adrien PIOT, Rodrigo TUMOLIN ROCHA, Hiroshi TOSHIYOSHI, Alain BOSSEBOEUF, Takashi SASAKI, Anton LAGOSH, and Moridi MOHSSEN, "Optical and Environmental Characterization Bench for 2D Micromirrors," in Proc. Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2023), Valletta, Malta, May 28-31, 2023.